Semi Rigid-Flex PCB(R-FPCB) with Blind Via
The laser blind hole processing of flexible PCB board also has many advantages, such as fast processing speed, high precision, small damage, and wide range of application. These advantages make laser blind hole processing technology an important choice in the flexible PCB board manufacturing process
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| Key attributes |
| Industry-specific attributes |
| Base Material:FR4 , HI-TG, Rogers PI so on |
| Board Thickness:0.1-4mm, Customizable |
| Board Size:Max. 250mm*520mm |
| Other attributes |
| Type:Semi Rigid-Flex PCB(R-FPCB) with Blind Via |
| Copper Thickness:0.5-6OZ, Customizable |
| Min. Hole Size:0.10/0.35mm |
| Min. Line Width:0.075mm/0.075mm |
| Min. Line Spacing:0.25mm |
| Surface Finishing:ENIG ,Lead free HASL,OSP |
| Surface treatment:Lead free HASL,Immersion Tin,Tin Plating,OSP,Carbon,Platinum,ENIG etc. |
| Layer:From single-sided to 40 layers |
| Solder mask color:Blue.green.red.black.white.etc |
| Max. Aspect Ratio:13:1 |
| attribute-list |
| Supply Ability:1000 Pieces per Day |
| Packaging and delivery |
| Package Type:Inner: vacuum packing or Anti-static package, Outer: export carto |
