Dielectric Material: High permittivity (εr ≥ 4.0) with low loss tan δ.
Copper Weight: Typically 1.2–1.8 oz/in² for optimal signal integrity.
Thermal Paste: Usually 0.1–0.3 mA/in² for efficient heat dissipation.
Temperature Range: Operates effectively from -50°C to 125°C.
Plate Thickness: Generally 0.03–0.05 mm to minimize signal attenuation.
Applications: Ideal for high-frequency communication, radar, and RF circuit boards.
This material ensures stability and reliability in demanding high-frequency applications.
