RO4350B+FR4 Hybrid High-Frequency PCB
RO4350B+FR4 hybrid PCBs combine Rogers RO4350B high-frequency laminates with standard FR4 substrates, optimizing cost and performance for RF/mixed-signal applications. Ideal for automotive radars, IoT gateways, and telecom infrastructure, this hybrid approach balances RF performance, thermal management, and cost efficiency.
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| Layer Stackup | Hybrid designs typically use RO4350B (Dk=3.48 @ 10 GHz, Df=0.0037) for critical RF layers and FR4 (Dk=4.3–4.7, Df=0.02) for non-RF layers, reducing material costs. |
| Impedance Control | Tight tolerance (±5%) achievable via RO4350B’s stable Dk, supporting frequencies up to 10 GHz for 5G, radar, and wireless systems. |
| Thickness Range | RO4350B layers (0.13–1.52 mm) paired with FR4 cores (0.2–3.2 mm) enable flexible multilayer configurations. |
| Thermal Performance | RO4350B’s low CTE (10–12 ppm/°C) and high thermal conductivity (0.62 W/m·K) mitigate heat buildup in high-power RF sections. |
| Surface Finish | ENIG or HASL ensures solderability for fine-pitch RF components (e.g., MMICs). |
| Hybrid Bonding | Specialized lamination processes prevent delamination between RO4350B and FR4, ensuring mechanical stability. |
| Copper Foil | 0.5–2 oz rolled or electro-deposited copper for signal integrity and power handling. |
